Electronic packaging
This is a sourced subject-directory page. Its presence does not mean a factual answer has been researched, or that the subject is a proven knowledge gap.
Scope of this subject
Here are entered works on the processes of physically locating, connecting and protecting electronic devices, components, etc. Works on the packaging of electronic products for marketing are entered under [Electronic apparatus and appliances--Packaging.]
Scope note supplied by the Library of Congress authority record.
Names and connections
Packaging (Electronics)
- Broader: Electronic apparatus and appliances
- Broader: Electronics
- Narrower: Ball grid array technology
- Narrower: Chip scale packaging
- Narrower: Electronic apparatus and appliances--Plastic embedment
- Narrower: Electronic apparatus and appliances--Protection
- Narrower: Fine pitch technology
- Narrower: Flip chip technology
- Narrower: Microelectronic packaging
- Narrower: Potting compounds (Electronics)
- Narrower: Surface mount technology
- Narrower: Wire bonding (Electronic packaging)
Up to 40 narrower headings are shown. Full Library of Congress authority record
Local answer status
No owner-reviewed answer has been published for this exact subject page. This is a gap in this collection; it does not establish that the answer is unavailable elsewhere.
Numeric address and provenance
Morton address: 10126489173629469248 · morton4x16-v1
Coordinates: (0, 20, 18066, 63488). The address interleaves categorical identifier bits. Nearby addresses are not guaranteed to describe semantically similar subjects.
Structured subject record · Markdown · Source snapshots and licenses
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