{"cited_by_count":673782,"description":"This cluster of papers focuses on the advances and challenges in the use of lead-free solders, interfacial reactions between solders and base materials, reliability studies in electronic packaging, high-temperature electronics, nanoparticle applications, electromigration effects, thermal behavior, rare earth element additions, and the use of conductive adhesives as alternatives.","display_name":"Electronic Packaging and Soldering Technologies","domain_id":"3","external_ids":{"openalex":"https://openalex.org/T10460","wikipedia":"https://en.wikipedia.org/wiki/Lead-free_solder"},"field_id":"22","id":"T10460","keywords":[{"display_name":"lead-free solder","id":"lead-free-solder","score":0.88,"url":"https://openalex.org/keywords/lead-free-solder"},{"display_name":"solder joint reliability","id":"solder-joint-reliability","score":0.9498,"url":"https://openalex.org/keywords/solder-joint-reliability"},{"display_name":"electronic 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Soldering Technologies","kind":"topic-directory","aeo_cohort":"topic-directory","catalogue_revision":"f050b5d4780b1289","numeric_address":"36239906611825201","address_version":"morton4x16-v1","coordinates":[3,22,2208,10460],"answer_status":"Directory metadata; local answer requires separate source review","truth_status":"Subject descriptor, not a factual answer or a demonstrated knowledge gap","reviewed_answer":null}