{"id":"S85084821","label":"Microelectronic packaging","description":"","source_url":"https://id.loc.gov/authorities/subjects/sh85084821","normalized_label":"microelectronic packaging","broader":["http://id.loc.gov/authorities/subjects/sh85042366","http://id.loc.gov/authorities/subjects/sh85084822"],"aliases":["Packaging (Microelectronics)"],"source_identifier":"http://id.loc.gov/authorities/subjects/sh85084821","provider":"lcsh","revision":"61318008c074353f","taxonomy_revision":"f050b5d4780b1289","title":"Microelectronic packaging","url":"/topics/S85084821","kind":"topic-directory","aeo_cohort":"topic-directory","catalogue_revision":"f050b5d4780b1289","numeric_address":"867022110290231872","address_version":"morton4x16-v1","coordinates":[0,20,18730,21504],"answer_status":"Directory metadata; local answer requires separate source review","truth_status":"Subject descriptor, not a factual answer or a demonstrated knowledge gap","reviewed_answer":null}